Layer: 6
Material: FR4
Thickness: 1.6mm
RoHS&UL standard
Min line width: 0.1mm
Min line space: 0.1mm
The smallest hole: 0.1mm
Buried and blind via structure: L1-L2; L2-L3, L5-L6
Surface processing; Immersion gold
Green soldermark

Our PCB capability:

Material used: FR4, High Tg Minimum 170C, Hifrequency, Metal based: Aluminium ect.
Maximum Panel Size: 26" X 26" (660mm X 660mm)
Line Width & Spacing:
Minimum Line Width (Internal): 4 mil (0.1 mm) for mass production and 3mil for samples
Minimum Line Width (External): 4 mil (0.1 mm) for mass production and 3 mils for samples.
Minimum Line Spacing (External): 4 mil (0.1 mm) for mass production and 3 mils for samples.
Layer Count & Thickness: 2-12 layers
Minimum Thickness (2 Layers): 4 mil (0.1 mm)
Minimum Thickness (4 Layers): 12 mil (0.3 mm)
Minimum Thickness (6 Layers): 16 mil (0.4 mm)
Minimum Thickness (8 Layers): 24 mil (0.6 mm)
Maximum Thickness(10layers): 200 mil (5.0 mm)
Layer to Layer Registration: +/- 5 mil (0.13 mm)
Via / Drill Size: Minimum Drill Hole Diameter 10 mil (0.25 mm)
Minimum Via Size: 8 mil (0.2 mm)
Hole to Hole Tolerance: +/- 3 mil (0.08 mm)
Hole to Edge Tolerance: +/- 5 mil (0.13 mm)
Micro Via: 4 mil (0.1 mm)
Solder Mask: Solder Mask Bridge Between Solder Dam 3 mil (0.07 mm)
Warpage: 0.5 %
Impedance: +/- 10%
Surface Finish: Hard Gold / ENIG / HASL / Carbon Ink / OSP (ENTEK CU 106 AX) / Immersion Tin
Min. SMT Ptich: 12 mil (0.2 mm)
Min. Parts footpins: 0201

Products involved fields: Consume Electronics, Medical equipments, Industrial commands, communications, auto parts ect.