Offer List (Total 69 Offers)
HDI PCB
Material: FR4
RoHS&UL standard
Min line width: 0.1mm
Min line space: 0.1mm
The smallest hole: 0.1mm
Surface processing; Immersion tin
Green soldermark
Our PCB ...
Last Updated: 2009-12-21
Layer: 2
Material: FR4
RoHS&UL standard
Min line width: 0.1mm
Min line space: 0.1mm
The smallest hole: 0.1mm
Surface processing; Hot Air Level
Green soldermark
Our PCB ...
Last Updated: 2009-12-21
Layer: 10
Material: FR4
ROHS&UL standard
Min line width: 0.1-0.3mm
Min line space: 0.1mm
The smallest hole: 0.1mm
Buried and blind via structure
Surface processing; ...
Last Updated: 2009-12-21
Layer: 4
Material: FR4
ROHS&UL standard
Min line width: 0.11
Min line space: 0.11mm
The smallest hole: 0.126mm
Buried and blind via structure
Surface processing; Hot Air ...
Last Updated: 2009-12-21
Layer: 8
Material: FR4
Thinkness: 1.6mm
ROHS&UL standard
Min line width: 0.1mm
Min line space: 0.1mm
The smallest hole: 0.1mm
Buried and blind via structure
Surface ...
Last Updated: 2009-12-21
Layer: 8
Material: FR4
ROHS&UL standard
Min line width: 0.12mm
Min line space: 0.12mm
The smallest hole: 0.12mm
Buried and blind via structure: L2-L4, L5-L7
Surface ...
Last Updated: 2009-12-21
Layer: 8
Material: FR4
ROHS&UL standard
Min line width: 0.1mm
Min line space: 0.1mm
The smallest hole: 0.1mm
Buried and blind via structure: L1-L3, L5-L7
Surface ...
Last Updated: 2009-12-21
Layer: 12
Material: FR4
RoHS&UL standard
Min line width: 0.1mm
Min line space: 0.1mm
The smallest hole: 0.1mm
Buried and blind via structure: L1-L4, L3-L6, L7-L8
Surface ...
Last Updated: 2009-12-21
Minimum space size: 0.2mm
RoHS&UL standard
NO. Of IC: 55PCS
Soldering compoent: 6728 PCS
Minum compoent size: 0201
Our PCB capability:
Material used: FR4, High Tg ...
Last Updated: 2009-12-21
Layer: 6
Material: FR4
ROHS&UL standard
Min line width: 0.1-0.3mm
Min line space: 0.1mm
The smallest hole: 0.1mm
Buried and blind via structure: L1-L2, L2-L4
Surface ...
Last Updated: 2009-12-21
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